Title:
LED PACKAGE, LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING LED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2016/174892
Kind Code:
A1
Abstract:
To improve the mounting density of an LED package used in a light emitting device, while providing the LED package with a position correction function by means of self-alignment during mounting. This LED package comprises: an LED element which has an element electrode on the lower surface; a phosphor layer which contains a phosphor and covers the upper surface and the lateral surface of the LED element; and an auxiliary electrode, the upper surface of which is bonded to the lower surface of the element electrode. The auxiliary electrode is larger than the element electrode, and has a step that makes the lower surface thereof smaller than the upper surface thereof. The auxiliary electrode is arranged such that an end portion thereof, which is on the side where the step is formed, is positioned inside the outer peripheral surface of the phosphor layer.
Inventors:
IMAI SADATO (JP)
WATANABE MASAHIDE (JP)
ISHII HIROHIKO (JP)
HIRASAWA KOKI (JP)
OMORI YUJI (JP)
WATANABE MASAHIDE (JP)
ISHII HIROHIKO (JP)
HIRASAWA KOKI (JP)
OMORI YUJI (JP)
Application Number:
PCT/JP2016/053835
Publication Date:
November 03, 2016
Filing Date:
February 09, 2016
Export Citation:
Assignee:
CITIZEN ELECTRONICS (JP)
CITIZEN HOLDINGS CO LTD (JP)
CITIZEN HOLDINGS CO LTD (JP)
International Classes:
H01L33/62; H01L23/48; H01L33/44; H01L33/50
Domestic Patent References:
| WO2011093454A1 | 2011-08-04 |
Foreign References:
| JP5634647B1 | 2014-12-03 | |||
| JP2011129726A | 2011-06-30 | |||
| JP2010267741A | 2010-11-25 | |||
| JP2012074732A | 2012-04-12 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Aoki 篤 (JP)
Aoki 篤 (JP)
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