Title:
LED PACKAGE AND LED MODULE
Document Type and Number:
WIPO Patent Application WO/2015/059499
Kind Code:
A3
Abstract:
According to a first aspect of the present invention there is provided a LED module. The LED module comprises a circuit board provided with an aperture that extends through the circuit board, and an LED package comprising one or more LED die mounted to a conductive substrate, the LED package being mounted to the circuit board with the one or more LED die aligned with the aperture. A first electrical connection between each of the one or more LED die and the circuit board is provided by a junction of a surface of the conductive substrate and a first electrical track provided on the circuit board, and a second electrical connection between each of the one or more LED die and the circuit board is provided by an interconnect device connecting the LED die to a second electrical track provided on the circuit board.
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Inventors:
REEVES JAMES (GB)
YOUNG ANDREW (GB)
YOUNG ANDREW (GB)
Application Number:
PCT/GB2014/053187
Publication Date:
June 18, 2015
Filing Date:
October 24, 2014
Export Citation:
Assignee:
LITECOOL LTD (GB)
International Classes:
H05K1/02; H01L33/64; H05K1/18
Domestic Patent References:
| WO2012053550A1 | 2012-04-26 |
Foreign References:
| US20030058650A1 | 2003-03-27 | |||
| US20070176182A1 | 2007-08-02 | |||
| US20030189830A1 | 2003-10-09 | |||
| US20070096132A1 | 2007-05-03 | |||
| US20090166655A1 | 2009-07-02 |
Attorney, Agent or Firm:
CHAPMAN, Alan (267 Banbury Road Summertow, Oxford Oxfordshire OX2 7HT, GB)
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