Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
LED PACKAGE SET AND LED BULB COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2018/194386
Kind Code:
A1
Abstract:
The present invention relates to an LED package set and an LED bulb comprising the same. The LED package set according to one embodiment of the present invention comprises: a substrate; an LED array including a plurality of LED chips, which are mounted on at least one surface of the substrate and are electrically connected; a plurality of LED packages respectively including a pair of electrode pads, which are respectively arranged on both ends of the substrate and are electrically connected to the LED array; and a connection lead for connecting electrode pads of one end between two neighboring LED packages. Electrode pads of the other end between the two neighboring LED packages are separated from each other, the plurality of LED packages are electrically connected in series, and the connection lead is integrated with the connected electrode pads.

Inventors:
JEONG YOUNG (KR)
Application Number:
KR2018/004534
Publication Date:
October 25, 2018
Filing Date:
April 19, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SEOUL SEMICONDUCTOR CO LTD (KR)
International Classes:
H01L25/075; F21K9/232; F21V19/00; H01L23/00; H01L23/495; H01L33/36; H01L33/50; H01L33/62; F21Y115/10
Foreign References:
JP2012129542A2012-07-05
KR101108984B12012-01-31
US20130271987A12013-10-17
KR20120073931A2012-07-05
JP2009534852A2009-09-24
Attorney, Agent or Firm:
AIP PATENT & LAW FIRM (KR)
Download PDF: