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Patent Searching and Data


Title:
LED PACKAGE SET AND LED BULB INCLUDING SAME
Document Type and Number:
WIPO Patent Application WO/2018/221952
Kind Code:
A1
Abstract:
The present invention relates to an LED package set and an LED bulb including the same. According to one embodiment of the present invention, provided is an LED package set comprising: a substrate; a first LED package arranged on the substrate and including at least one first LED chip; a second LED package arranged on the substrate and including at least one second LED chip; and a resistor arranged on the substrate, connected with the first LED package in series, and connected with the second LED package in parallel. In addition, the second LED package is connected with the first LED package and the resistor in parallel. Moreover, the first LED package and the second LED package emit lights having different color temperatures from each other.

Inventors:
LEE SEONG JIN (KR)
LEE JONG KOOK (KR)
Application Number:
PCT/KR2018/006137
Publication Date:
December 06, 2018
Filing Date:
May 30, 2018
Export Citation:
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Assignee:
SEOUL SEMICONDUCTOR CO LTD (KR)
International Classes:
H01L25/075; F21K9/00; H01L33/36; H01L33/50; H01L33/62
Foreign References:
KR20110021639A2011-03-04
KR20130002110A2013-01-07
JP2015038853A2015-02-26
KR20110101515A2011-09-16
US20140361697A12014-12-11
Other References:
See also references of EP 3618111A4
Attorney, Agent or Firm:
AIP PATENT & LAW FIRM (KR)
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