Title:
LED PACKAGE SUBSTRATE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2017/206331
Kind Code:
A1
Abstract:
An LED package substrate and a preparation method therefor. The LED package substrate comprises: a package substrate (101) used for protecting and bearing an LED chip; a reflective layer (107, 108) located on the package substrate (101); a light conversion layer (109) located on the reflective layer (107, 108); a package substrate-free LED chip located on the light conversion layer (109), said chip being capable of bidirectionally emitting light having a specific wavelength. The package substrate includes the light conversion layer (109), thereby simplifying a package process. The preparation process is advantageous for the large-batch preparation of package substrates containing a uniform fluorescent powder, and increases product yield and production.
Inventors:
ZHAO LONG (CN)
Application Number:
PCT/CN2016/094070
Publication Date:
December 07, 2017
Filing Date:
August 09, 2016
Export Citation:
Assignee:
SHENZHEN CHAO WEIDA TECH CO LTD (CN)
International Classes:
H01L33/50; H01L33/00; H01L33/48; H01L33/60
Domestic Patent References:
| WO2015011925A1 | 2015-01-29 |
Foreign References:
| CN104091875A | 2014-10-08 | |||
| CN105914285A | 2016-08-31 | |||
| CN203941950U | 2014-11-12 |
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