LED PACKAGE WITH INTEGRATED FEATURES FOR GAS OR LIQUID COOLING

Title:

LED PACKAGE WITH INTEGRATED FEATURES FOR GAS OR LIQUID COOLING

Document Type and Number:

WIPO Patent Application WO/2016/109611

Kind Code:

A3

Abstract:

A light emitting device is provided that includes an integral heat dissipation element. This heat dissipation element is included in the leadframe that is used to facilitate fabrication of the light emitting device, to provide a single common substrate that forms both the heat dissipation element and the conductive elements for coupling the light emitting device to external sources of power. The heat dissipation element may extend beyond the protective structure that surrounds the light emitting element to facilitate heat dissipation to the surrounding medium.

Inventors:

MEHNERT AXEL (US)
GOLUBOVIC DUSAN (US)
DONKER MARCUS FRANCISCUS (US)
EGGINK HENDRIK JAN (US)
VAN HONSCHOOTEN RENE (US)
TREURNIET THEODOOR CORNELIS (US)

Application Number:

PCT/US2015/067973

Publication Date:

August 25, 2016

Filing Date:

December 30, 2015

Export Citation:

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Assignee:

KONINKLIJKE PHILIPS NV (NL)
MEHNERT AXEL (US)
GOLUBOVIC DUSAN (US)
DONKER MARCUS FRANCISCUS (NL)
EGGINK HENDRIK JAN (NL)
VAN HONSCHOOTEN RENE (NL)
TREURNIET THEODOOR CORNELIS (NL)

International Classes:

H01L33/64; H01L25/075; H01L33/52

Domestic Patent References:

WO2005101489A2	2005-10-27
WO2014016734A1	2014-01-30
WO2009141960A1	2009-11-26

Foreign References:

US20040180459A1	2004-09-16
US20110303941A1	2011-12-15
KR20130017461A	2013-02-20
JP2007096236A	2007-04-12

Attorney, Agent or Firm:

HSIA, David C. (465 Fairchild Dr. Ste. 12, Mountain View California, US)

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