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Title:
LED PACKAGE
Document Type and Number:
WIPO Patent Application WO/2018/088671
Kind Code:
A1
Abstract:
An LED package having a plurality of light emitting regions includes a plurality of LED chips. The LED package further includes a plurality of electrode portions on which each of the plurality of LED chips is mounted, and a package mold portion having a plurality of openings formed on one surface thereof so as to each emit light by the plurality of LED chips.

Inventors:
AN JONGUK (KR)
PARK NOHJOON (KR)
Application Number:
PCT/KR2017/007628
Publication Date:
May 17, 2018
Filing Date:
July 17, 2017
Export Citation:
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Assignee:
ALLIX CO LTD (KR)
AN JONGUK (KR)
International Classes:
H01L25/075; H01L25/16; H01L33/36; H01L33/48; H01L33/50; H01L33/62; H01L33/64
Foreign References:
US20110037083A12011-02-17
US20100128461A12010-05-27
US20130334553A12013-12-19
US20100187549A12010-07-29
KR20100044409A2010-04-30
Attorney, Agent or Firm:
SUAN INTELLECTUAL PROPERTY (KR)
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