Title:
LED PACKAGING MATERIAL AND PREPARATION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/205336
Kind Code:
A1
Abstract:
Disclosed in the present invention is a light-emitting diode (LED) packaging material, which is formed by compositing graphene and silane or epoxy resin so as to alleviate deficiencies which exist when preparing an LED packaging material by means of a single silane or epoxy resin by virtue of the characteristics of graphene so as to improve the performance of the LED packaging material. Further disclosed in the present invention is a method for use in preparing an LED packaging material. The LED packaging material of the present invention and the preparation method therefor, being formed by compositing graphene and silane or epoxy resin so as to alleviate deficiencies which exist when preparing an LED packaging material by means of a single silane or epoxy resin by virtue of the characteristics of graphene so as to improve the performance of the LED packaging material.
Inventors:
WANG HAIJUN (CN)
Application Number:
PCT/CN2017/087821
Publication Date:
November 15, 2018
Filing Date:
June 09, 2017
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
C08L63/00; C08L83/06
Foreign References:
| CN105255120A | 2016-01-20 | |||
| CN105062082A | 2015-11-18 | |||
| CN106449952A | 2017-02-22 | |||
| CN103408895A | 2013-11-27 |
Attorney, Agent or Firm:
SCIHEAD IP LAW FIRM (CN)
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