Title:
LED PIXEL PACKAGE COMPRISING ACTIVE PIXEL IC, AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/166814
Kind Code:
A1
Abstract:
The present invention relates to: an LED pixel package comprising an active pixel IC, the LED pixel package having excellent display contrast and excellent black display; and a manufacturing method therefor. More particularly, the present invention provides a method for manufacturing an LED pixel package comprising an active pixel IC, the method comprising the steps of: (a) flip chip bonding, on a substrate, at least one LED chip and at least one active pixel IC; (b) molding the upper part of the substrate with a black resin so as to cover the entire LED chip and active pixel IC; (c) grinding the upper part of a region molded with the black resin so that the upper surface of the LED chip is exposed; and (d) cutting the LED chip and the active pixel IC so as to form a pair of each.
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Inventors:
KIM JIN HYUK (KR)
KIM JONG SUN (KR)
KIM JONG SUN (KR)
Application Number:
PCT/KR2019/018504
Publication Date:
August 20, 2020
Filing Date:
December 26, 2019
Export Citation:
Assignee:
SILICONINSIDE CO LTD (KR)
International Classes:
H01L25/075; H01L21/76; H01L21/78; H01L27/15; H01L33/00; H01L33/56; H01L33/62
Foreign References:
| JP2014154881A | 2014-08-25 | |||
| KR20160032429A | 2016-03-24 | |||
| KR20180017913A | 2018-02-21 | |||
| KR20110046142A | 2011-05-04 | |||
| KR20010038119A | 2001-05-15 |
Attorney, Agent or Firm:
KIM, Kyung Soo (KR)
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