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Patent Searching and Data


Title:
LED SEALANT COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/062513
Kind Code:
A1
Abstract:
[Problem] To provide: an LED sealant composition; a cured product obtained by curing said LED sealant composition; and an LED device having an LED element sealed with said cured product. [Solution] This LED sealant composition comprises (A) a linear organopolysiloxane that has at least two alkenyl groups bound to a silicon atom per molecule and that has three types of structural units represented by formula (1): (R1R2R3SiO1/2)a(R4R5SiO2/2)b(R6 2SiO2/2)c, (B) a linear organopolysiloxane that has at least two hydrogen atoms bound to a silicon atom per molecule and that has three types of structural units represented by formula (2): (R7R8R9SiO1/2)d(R10R11SiO2/2)e(R12 2SiO2/2)f, and (C) a hydrosilylation catalyst, wherein R4 in formula (1) and/or R10 in formula (2) represents a biphenylyl group.

Inventors:
SHUTO KEISUKE (JP)
KATO TAKU (JP)
KOBAYASHI JUNPEI (JP)
SUZUKI MASAYOSHI (JP)
Application Number:
PCT/JP2017/035565
Publication Date:
April 05, 2018
Filing Date:
September 29, 2017
Export Citation:
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Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
H01L33/56; C08L83/05; C08L83/07; C09K3/10; H01L23/29; H01L23/31
Domestic Patent References:
WO2016063649A12016-04-28
Foreign References:
JP2014084418A2014-05-12
JP2013064062A2013-04-11
US20150368468A12015-12-24
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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