Title:
LENS ATTACHED SUBSTRATE, LAYERED LENS STRUCTURE, CAMERA MODULE, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/022187
Kind Code:
A1
Abstract:
To suppress degradation in image quality. The present technology relates to, for example, a lens attached substrate including a substrate which has a through-hole formed therein and a light shielding film formed on a side wall of the through-hole and a lens resin portion which is formed inside the through-hole of the substrate. The present technology can be applied to, for example, a lens attached substrate, a layered lens structure, a camera module, a manufacturing apparatus, a manufacturing method, an electronic device, a computer, a program, a storage medium, a system, and the like.
Inventors:
MORIYA YUSUKE (JP)
IWASAKI MASANORI (JP)
OINOUE TAKASHI (JP)
HAGIMOTO YOSHIYA (JP)
MATSUGAI HIROYASU (JP)
ITOU HIROYUKI (JP)
SAITO SUGURU (JP)
OHSHIMA KEIJI (JP)
FUJII NOBUTOSHI (JP)
TAZAWA HIROSHI (JP)
SHIRAIWA TOSHIAKI (JP)
ISHIDA MINORU (JP)
IWASAKI MASANORI (JP)
OINOUE TAKASHI (JP)
HAGIMOTO YOSHIYA (JP)
MATSUGAI HIROYASU (JP)
ITOU HIROYUKI (JP)
SAITO SUGURU (JP)
OHSHIMA KEIJI (JP)
FUJII NOBUTOSHI (JP)
TAZAWA HIROSHI (JP)
SHIRAIWA TOSHIAKI (JP)
ISHIDA MINORU (JP)
Application Number:
PCT/JP2016/003349
Publication Date:
February 09, 2017
Filing Date:
July 15, 2016
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G02B13/00; B29D11/00; G02B3/00; G02B5/00; G02B27/00
Domestic Patent References:
| WO2011010739A1 | 2011-01-27 |
Foreign References:
| JP2011180292A | 2011-09-15 | |||
| US4761062A | 1988-08-02 | |||
| US6115187A | 2000-09-05 | |||
| US20030136759A1 | 2003-07-24 | |||
| JP2011180292A | 2011-09-15 | |||
| JP2011138089A | 2011-07-14 | |||
| JP2009279790A | 2009-12-03 | |||
| JP2010256563A | 2010-11-11 | |||
| JP2013001091A | 2013-01-07 | |||
| JP2010204631A | 2010-09-16 |
Attorney, Agent or Firm:
NISHIKAWA, Takashi et al. (JP)
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