Title:
LEVELING AGENT, AND ELECTROPLATING COMPOSITION COMPRISING SAME FOR FILLING VIA HOLE
Document Type and Number:
WIPO Patent Application WO/2023/008963
Kind Code:
A1
Abstract:
The present invention relates to a leveling agent and an electroplating composition comprising same. When a via hole of a substrate is filled with the electroplating composition according to the present invention, the via hole can be filled relatively quickly while minimizing the formation of dimples or voids.
Inventors:
CHUN SUNG WOOK (KR)
CHUNG BO MOOK (KR)
KIM DEA GEUN (KR)
KO NAK EUN (KR)
SIM JU YONG (KR)
CHUNG BO MOOK (KR)
KIM DEA GEUN (KR)
KO NAK EUN (KR)
SIM JU YONG (KR)
Application Number:
PCT/KR2022/011227
Publication Date:
February 02, 2023
Filing Date:
July 29, 2022
Export Citation:
Assignee:
YMT CO LTD (KR)
International Classes:
C25D3/02; C25D3/38; C25D5/02; C25D5/18; C25D5/56; H05K3/42
Foreign References:
| KR20190061627A | 2019-06-05 | |||
| KR20120067315A | 2012-06-25 | |||
| KR20110103891A | 2011-09-21 | |||
| US20160076160A1 | 2016-03-17 | |||
| US5252196A | 1993-10-12 | |||
| KR102339868B1 | 2021-12-16 | |||
| KR20120077058A | 2012-07-10 |
Other References:
See also references of EP 4151778A4
Attorney, Agent or Firm:
KWAK, Hyun Kyu (KR)
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