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Title:
LID-SPOUT ASSEMBLY FOR A PACKAGE AND PACKAGE HAVING A LID-SPOUT ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2022/078811
Kind Code:
A3
Abstract:
There is described lid-spout assembly (3) for a package (1) having a designated pour opening and being filled with a pourable product. The lid-spout assembly (3) comprises at least a collar (5), a coupling ring (6) arranged around a portion of the collar (5), a lid (7) and a connecting element (8) connecting the lid (7) and the coupling ring (6) with one another. The collar (5) comprises a first annular interaction ridge (30) and the coupling ring (6) has at least one flap (33) comprising at least one engagement surface (34) abutting and/or designed to abut against an abutment surface (35) of the first annular interaction ridge (30). The collar (5) also comprises a second annular interaction ridge protruding from the outer surface (16) of the collar (5) and being axially displaced from the first annular interaction ridge (30). The flap (33) further comprises at least one contact surface (36) designed to interact and/or interacting with a guiding surface (43) of the second annular interaction ridge (31) so as to direct the engagement surface (34) towards and/or against the abutment surface (35).

Inventors:
ZANON PAOLO (IT)
VIETRI ANNA (IT)
DE PAOLA ROCCO (IT)
Application Number:
PCT/EP2021/077369
Publication Date:
April 06, 2023
Filing Date:
October 05, 2021
Export Citation:
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Assignee:
TETRA LAVAL HOLDINGS & FINANCE (CH)
International Classes:
B65D5/74; B65D41/48; B65D47/08
Foreign References:
JP2005335797A2005-12-08
EP0213742A21987-03-11
US4721218A1988-01-26
JP2018203338A2018-12-27
Attorney, Agent or Firm:
TETRA PAK - PATENT ATTORNEYS SE (SE)
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