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Patent Searching and Data


Title:
LID
Document Type and Number:
WIPO Patent Application WO/2017/090482
Kind Code:
A1
Abstract:
This lid has at least a substrate layer, an anchor coat layer, a stress relaxation layer, and a hot-melt adhesive layer, and has a structure obtained by layering said layers in this order. The hot-melt adhesive that constitutes the hot-melt adhesive layer contains 20-50 mass% of an ethylene-vinyl acetate copolymer as a component (A), and relative to 100 parts by mass of the ethylene-vinyl acetate copolymer constituting the component (A), also contains 8-80 parts by mass of an adhesiveness-imparting agent as a component (B), 85-230 parts by mass of a wax as a component (C), and 15-200 parts by mass of talc as a component (D).

Inventors:
MISAWA SHINJI (JP)
NAKAJIMA TAKESHI (JP)
KURITA KEIGO (JP)
ISHIGURO KENJI (JP)
HIGASA SHO (JP)
Application Number:
PCT/JP2016/083783
Publication Date:
June 01, 2017
Filing Date:
November 15, 2016
Export Citation:
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Assignee:
DYNIC CORP (JP)
International Classes:
B65D77/20; B32B27/00; B32B27/20; B32B27/28; C09D5/00; C09D201/00; C09J11/04; C09J11/06; C09J11/08; C09J123/08; C09J131/04
Foreign References:
JPH10156995A1998-06-16
JP2011156822A2011-08-18
JP2013116745A2013-06-13
JPH11333964A1999-12-07
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
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