Title:
LIGHT BEAM BONDING
Document Type and Number:
WIPO Patent Application WO2005096458
Kind Code:
B1
Abstract:
A soldering method using light beams and a mask for light beam shielding. The soldering method is a method for connecting a conductive line with a contact by light beams, which includes a step of arranging the conductive line in an area whereupon the contact is formed, a step of supplying a solder to the area whereupon the contact is formed, a step of arranging the mask for partially shielding the connector from light beams, and a step of connecting the conductive line with the contact by melting the solder by irradiating light beams.
Inventors:
OKANO KAZUYA (JP)
Application Number:
PCT/JP2005/006285
Publication Date:
December 08, 2005
Filing Date:
March 31, 2005
Export Citation:
Assignee:
FCI ASIA TECHNOLOGY PTE LTD (SG)
FRAMATOME CONNECTORS INT (FR)
OKANO KAZUYA (JP)
FRAMATOME CONNECTORS INT (FR)
OKANO KAZUYA (JP)
International Classes:
H01R43/02; H05K3/34; (IPC1-7): H01R43/02
Download PDF: