Title:
LIGHT CURABLE (METH)ACRYLATE RESIN COMPOSITION FOR THERMOPLASTIC ELASTOMERS BONDING
Document Type and Number:
WIPO Patent Application WO/2020/163975
Kind Code:
A1
Abstract:
Provided is a light curable (meth) acrylate resin composition for thermoplastic elastomer bonding. The light curable (meth) acrylate resin composition comprises: a (meth) acrylic monomer, a polyolefin (meth) acrylate oligomer having a viscosity of 200 000 to 2 500 000 mPa*s at 25°C, and a photoinitiator. Provided are a cured product of the light curable (meth) acrylate resin composition and a use of the composition.
Inventors:
ZHANG HEQIANG (CN)
SONG CHONGJIAN (CN)
WANG ZUOHE (CN)
SUN CHONGYANG (CN)
SONG CHONGJIAN (CN)
WANG ZUOHE (CN)
SUN CHONGYANG (CN)
Application Number:
PCT/CN2019/074765
Publication Date:
August 20, 2020
Filing Date:
February 11, 2019
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL (CHINA) CO LTD (CN)
HENKEL (CHINA) CO LTD (CN)
International Classes:
C09J4/02; C09J7/00
Domestic Patent References:
| WO2008091114A1 | 2008-07-31 |
Foreign References:
| CN103108930A | 2013-05-15 | |||
| JP2018090683A | 2018-06-14 | |||
| CN105969253A | 2016-09-28 | |||
| CN101717204A | 2010-06-02 | |||
| JP2008024862A | 2008-02-07 |
Other References:
See also references of EP 3924439A4
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LIMITED (CN)
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