Title:
Light cure epoxy composition
Document Type and Number:
WIPO Patent Application WO/2018/184151
Kind Code:
A1
Abstract:
Provided is a light curable composition comprising a) an epoxy resin component; b) epoxy silane oligomer having a general structure (1) or (2) or (3); and c) a cationic photoinitiator. The said composition provides good adhesion properties even under autoclave conditions.
Inventors:
CHEN CHUNFU (JP)
LI BIN (CN)
WANG CHOC (CN)
IWASAKI SHUICHI (JP)
KANARI MASAO (JP)
LI BIN (CN)
WANG CHOC (CN)
IWASAKI SHUICHI (JP)
KANARI MASAO (JP)
Application Number:
PCT/CN2017/079452
Publication Date:
October 11, 2018
Filing Date:
April 05, 2017
Export Citation:
Assignee:
HENKEL AG & CO KGAA (DE)
HENKEL CHINA CO LTD (CN)
HENKEL CHINA CO LTD (CN)
International Classes:
C08L63/00; C08G77/14; C09J163/00; C08G59/02
Domestic Patent References:
| WO2003087181A1 | 2003-10-23 |
Foreign References:
| CN102702534A | 2012-10-03 | |||
| US20050245643A1 | 2005-11-03 | |||
| EP1099728A1 | 2001-05-16 | |||
| CN101531839A | 2009-09-16 |
Attorney, Agent or Firm:
NTD PATENT AND TRADEMARK AGENCY LIMITED (CN)
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