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Title:
LIGHT DETECTION DEVICE, METHOD FOR MANUFACTURING LIGHT DETECTION DEVICE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/265059
Kind Code:
A1
Abstract:
The present invention provides a light detection device in which a desired through electrode is formed. A light detection device according to the present invention comprises: a first semiconductor layer which has a photoelectric conversion region, one surface of which is a first surface, and the other surface of which is a second surface serving as a light entry surface; a second semiconductor layer one surface of which is a third surface and the other surface of which is a fourth surface; a second wiring layer which is superimposed on the third surface of the second semiconductor layer; a third wiring layer which is superimposed on the fourth surface of the second semiconductor layer; a first wiring layer one surface of which is superimposed on the first surface of the first semiconductor layer and the other surface of which is superimposed on one of the second wiring layer and the third wiring layer; a first conductor which has a first width, which is composed of a first material, and through which the second semiconductor layer penetrates in the thickness direction; and a second conductor which has a second width smaller than the first width, which is composed of a second material different from the first material, and through which the second semiconductor layer penetrates in the thickness direction.

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Inventors:
HANEDA MASAKI (JP)
KOTOO KENGO (JP)
SHIRASU YOSHIKI (JP)
SHIMOMURA KAZUKI (JP)
FUJII NOBUTOSHI (JP)
HIRANO TAKAAKI (JP)
FUJII YOSUKE (JP)
OINOUE TAKASHI (JP)
SAITO SUGURU (JP)
ISHIMARU TOSHIYUKI (JP)
OHSHIMA KEIJI (JP)
IMAI SHINICHI (JP)
KUROTORI TAKUYA (JP)
SUGIYAMA TOMOHIRO (JP)
MITSUHASHI IKUE (JP)
TOKUOKA KENICHI (JP)
Application Number:
PCT/JP2022/024051
Publication Date:
December 22, 2022
Filing Date:
June 16, 2022
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146; H01L21/02; H01L21/3205; H01L21/768; H01L23/522
Domestic Patent References:
WO2020137283A12020-07-02
WO2021066069A12021-04-08
Foreign References:
JP2018170471A2018-11-01
JP2016058521A2016-04-21
JP2018182038A2018-11-15
JP2018098495A2018-06-21
JP2020182112A2020-11-05
JP2020161717A2020-10-01
JP2018190766A2018-11-29
JP2013201188A2013-10-03
JP2019140162A2019-08-22
JPH08162459A1996-06-21
JP2014099582A2014-05-29
JP2018190766A2018-11-29
JP2011204915A2011-10-13
Attorney, Agent or Firm:
TANAKA Hidetetsu et al. (JP)
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