Title:
LIGHT EMISSION AND HEAT DISSIPATION STRUCTURE OF LED LIGHT SOURCE AND LIGHT EMISSION AND HEAT DISSIPATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/029808
Kind Code:
A1
Abstract:
A light emission and heat dissipation structure of an LED light source and a light emission and heat dissipation method therefor. The LED light source is double-sided LED chips (A). Several double-sided LED chips (A) are arranged on a transparent heat dissipation plate (100). The transparent heat dissipation plate (100) comprises a transparent heat dissipation substrate (110) and an electrically-conductive heat dissipation thin film layer (120). The electrically-conductive heat dissipation thin film layer (120) is attached onto the outer surface of the transparent heat dissipation substrate (110). The electrically-conductive heat dissipation thin film layer (120) comprises fully attached parts (121) and window parts (122). The fully attached parts (121) and the window parts (122) are separated by gaps. The double-sided LED chips (A) are horizontally arranged at where the window parts (122) are located. A light produced at the outer lateral surfaces of the double-sided LED chips (A) is transmitted directly into the external environment. A light produced at the inner lateral sides of the double-sided LED chips is transmitted to the external environment via the window parts (122) and then through the transparent heat dissipation substrate (110).
Inventors:
CAI HONG (CN)
Application Number:
PCT/CN2015/087461
Publication Date:
March 03, 2016
Filing Date:
August 18, 2015
Export Citation:
Assignee:
CAI HONG (CN)
International Classes:
F21V29/00
Foreign References:
| CN204062597U | 2014-12-31 | |||
| CN204062595U | 2014-12-31 | |||
| CN204300813U | 2015-04-29 | |||
| CN103925581A | 2014-07-16 | |||
| CN102927483A | 2013-02-13 | |||
| CN103075667A | 2013-05-01 |
Attorney, Agent or Firm:
SHENZHEN JAHONGBO INTELLECTUAL PROPERTY AGENT OFFICE (CN)
深圳市嘉宏博知识产权代理事务所 (CN)
深圳市嘉宏博知识产权代理事务所 (CN)
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