LIGHT-EMITTING COMPONENT PACKAGE, LIGHT-EMITTING COMPONENT PACKAGING APPARATUS, AND LIGHT SOURCE DEVICE

Title:

LIGHT-EMITTING COMPONENT PACKAGE, LIGHT-EMITTING COMPONENT PACKAGING APPARATUS, AND LIGHT SOURCE DEVICE

Document Type and Number:

WIPO Patent Application WO2008043264

Kind Code:

A8

Abstract:

A light-emitting component package includes a light-emitting component (1511), a heat-conductor (1513), a set of electric-conducting leads (1512), and a heat dissipation base (1052). The light-emitting component (1511) is disposed on the heat-conductor (1513) and electrically coupled to the set of electric-conducting leads (1512). The heat-conductor (1513) is insulated from the set of electric-conducting leads (1512) and inserted in a hole (1523) of the heat dissipation base (1052). Meanwhile, the set of electric-conducting leads (1512) is located between at least two heat-conducting portions of the heat-conductor (1513) to form the package with heat outside and electricity inside. A light-emitting component packaging apparatus including a leadframe and a molding base, and a light source device are provided.

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Inventors:

LIN MING-TE (CN)

Application Number:

PCT/CN2007/002840

Publication Date:

July 24, 2008

Filing Date:

September 28, 2007

Export Citation:

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Assignee:

IND TECH RES INST (CN)
LIN MING-TE (CN)

International Classes:

H01F38/14; H01L23/12; H01L23/495; H01L25/00; H01L33/64; H01L33/62

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