Title:
LIGHT EMITTING DEVICE, BACKLIGHT MODULE EMPLOYING SAME, LIGHT SOURCE MODULE, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/024768
Kind Code:
A1
Abstract:
Provided in the present invention is a light emitting device. The light emitting device comprises a light emitting chip, a light emitting layer, and a light guide layer. The light emitting chip comprises an upper surface and a side surface. The light emitting layer is formed on the upper surface of the light emitting chip. The light guide layer is formed on the side surface of the light emitting chip. The light guide layer comprises multiple luminescent particles and multiple microbeads. The light emitting layer and the light guide layer do not contain an adhesive. Further provided in the present invention are a backlight module employing the light emitting device, light source module, and manufacturing method of the light emitting device. The light emitting device of the present invention can reduce light leakage from the side surface of the light emitting chip, thus improving the luminous efficiency of the light emitting device. In addition, the present invention has a simple manufacturing process and low costs.
Inventors:
WU YU-CHAO (CN)
LIU YAN (CN)
WU GUANCHEN (CN)
WU GUANWEI (CN)
LIU YAN (CN)
WU GUANCHEN (CN)
WU GUANWEI (CN)
Application Number:
PCT/CN2018/097306
Publication Date:
February 07, 2019
Filing Date:
July 27, 2018
Export Citation:
Assignee:
WU YU CHAO (CN)
International Classes:
H01L25/075
Foreign References:
| CN102479909A | 2012-05-30 | |||
| CN1691359A | 2005-11-02 | |||
| CN104937733A | 2015-09-23 |
Attorney, Agent or Firm:
SHENZHEN SCIENBIZIP INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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