Title:
LIGHT EMITTING DEVICE AND BACKLIGHT DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/137005
Kind Code:
A1
Abstract:
The tip surface (12a) of a bumper section (12) is higher than the upper end surface (4a) of a case member (4). Thereby, even if a light guide body (106) collides with a light emitting device (10) due to thermal expansion, the bumper section (12) comes into contact with the light guide body (106) and receives the force from the light guide body (106). As a result, the force from the light guide body (106) is prevented from being transferred to the case member (4). Accordingly, the amount of light flux incident to the light guide body (106) can be increased and the probability of breaking of a wire due to the thermal expansion of the light guide body (106) can be reduced.
Inventors:
KATOH MASAAKI
KONDOH MASAKI
KONDOH MASAKI
Application Number:
PCT/JP2013/055439
Publication Date:
September 19, 2013
Filing Date:
February 28, 2013
Export Citation:
Assignee:
SHARP KK (JP)
International Classes:
F21S2/00; H01L33/62; F21Y101/02
Domestic Patent References:
| WO2008081696A1 | 2008-07-10 | |||
| WO2010041498A1 | 2010-04-15 |
Foreign References:
| JP2007012727A | 2007-01-18 | |||
| JP2011134902A | 2011-07-07 | |||
| JP2008198807A | 2008-08-28 | |||
| JP2007096240A | 2007-04-12 | |||
| JP2008135701A | 2008-06-12 | |||
| JP2008277065A | 2008-11-13 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
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