Title:
LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/163326
Kind Code:
A1
Abstract:
This light emitting device is provided with: a support substrate 10 which has a first major surface 101 and a second major surface 102; a light emitting element 20 which has a stacked structure having a second semiconductor layer 22 disposed over a first semiconductor layer 21, and which is disposed in a part of the first major surface 101; a metal oxide-containing resin 30 which is disposed on the first major surface 101 in a remaining region other than the region in which the light emitting element 20 is disposed, the metal oxide-containing resin 30 containing a metal oxide; and a light transmissive resin 40 disposed over the support substrate 10 with the light emitting element 20 interposed therebetween. The support substrate 10 and the light transmissive resin 40 are connected with the metal oxide-containing resin 30 interposed therebetween.
Inventors:
MATSUO TETSUJI (JP)
Application Number:
PCT/JP2017/009270
Publication Date:
September 13, 2018
Filing Date:
March 08, 2017
Export Citation:
Assignee:
SANKEN ELECTRIC CO LTD (JP)
International Classes:
H01L33/48
Domestic Patent References:
| WO2009066430A1 | 2009-05-28 |
Foreign References:
| JP2013232539A | 2013-11-14 | |||
| JP2015179777A | 2015-10-08 | |||
| JP2015128085A | 2015-07-09 | |||
| JP2016092016A | 2016-05-23 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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