Title:
LIGHT EMITTING DEVICE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2015/182899
Kind Code:
A1
Abstract:
An embodiment comprises: a substrate having a chip mounting region; first and second wiring layers disposed on the substrate around the chip mounting region so as to be spaced apart from each other; and a plurality of light emitting chips disposed on the chip mounting region, wherein the first wiring layer comprises a first wiring pattern disposed at one side of a reference line and having a first concave part, and a first extending pattern extending from the first wiring pattern to the other side of the reference line, the second wiring layer comprises a second wiring pattern disposed at the other side of the reference line and having a second concave part, and a second extending pattern extending from the second wiring pattern to one side of the reference line, and the reference line is a straight line passing through the center of the chip mounting region.
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Inventors:
KIM DAE GEUN (KR)
KIM KYOUNG UN (KR)
KIM SEUL KI (KR)
MIN BONG KUL (KR)
BAK GYU HYEONG (KR)
KIM KYOUNG UN (KR)
KIM SEUL KI (KR)
MIN BONG KUL (KR)
BAK GYU HYEONG (KR)
Application Number:
PCT/KR2015/004777
Publication Date:
December 03, 2015
Filing Date:
May 13, 2015
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L33/62
Foreign References:
| JP2014067816A | 2014-04-17 | |||
| JP2012015467A | 2012-01-19 | |||
| US20140103797A1 | 2014-04-17 | |||
| KR20130087374A | 2013-08-06 | |||
| EP2211082B1 | 2011-08-24 |
Other References:
See also references of EP 3151291A4
Attorney, Agent or Firm:
PARK, Young Bok et al. (KR)
박영복 (KR)
박영복 (KR)
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