LIGHT EMITTING DEVICE PACKAGE

WIPO Patent Application WO/2019/054760

A1

An embodiment relates to a light emitting device package and a lighting apparatus. The light emitting device package according to the embodiment may comprise: a first package body; a second package body disposed on the first package body and including an opening extending through the upper surface and the lower surface thereof; and a light emitting device disposed in the opening and including a first bonding portion and a second bonding portion. The first package body may comprise a first opening portion and a second opening portion extending through the upper surface and the lower surface thereof. The upper surface of the first package body may be connected to the lower surface of the second package body, wherein the first bonding portion may be disposed on the first opening portion and the second bonding portion may be disposed on the second opening portion.

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KIM KI SEOK (KR)
KIM WON JUNG (KR)
SONG JUNE O (KR)
LIM CHANG MAN (KR)

PCT/KR2018/010717

March 21, 2019

September 12, 2018

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LG INNOTEK CO LTD (KR)

H01L33/48; F21K9/00; H01L33/20; H01L33/50; H01L33/52

JP2007220852A	2007-08-30
KR20110123945A	2011-11-16
KR20120056164A	2012-06-01
KR101590463B1	2016-02-01
EP2806471B1	2017-07-19

HAW, Yong Noke (KR)

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