Title:
LIGHT EMITTING DEVICE PACKAGE
Document Type and Number:
WIPO Patent Application WO/2019/054793
Kind Code:
A1
Abstract:
A light emitting device package according to an embodiment may comprise a first package body which includes first and second opening portions passing through the upper surface and lower surface; a second package body which is disposed on the first package body and includes a third opening portion passing through the upper surface and lower surface; a light emitting device which is disposed in the third opening portion; a first resin which is disposed between the upper surface of the first package body and the light emitting device; and a second resin which is disposed in the third opening portion. According to the embodiment, the top surface of the first package body is coupled to the lower surface of the second package body, the first package body includes a recess which is recessed from the upper surface of the first package body to the bottom surface of the first package body, the first resin is disposed in the recess, the first resin and the second resin comprise materials different from each other, and the first resin may be in contact with the light emitting device and the second resin.
Inventors:
SONG JUNE O (KR)
KIM KI SEOK (KR)
LIM CHANG MAN (KR)
KIM KI SEOK (KR)
LIM CHANG MAN (KR)
Application Number:
PCT/KR2018/010827
Publication Date:
March 21, 2019
Filing Date:
September 14, 2018
Export Citation:
Assignee:
LG INNOTEK CO LTD (KR)
International Classes:
H01L33/48; H01L33/20; H01L33/54
Foreign References:
| JP2007220852A | 2007-08-30 | |||
| KR20130014197A | 2013-02-07 | |||
| KR20120056164A | 2012-06-01 | |||
| KR20150141337A | 2015-12-18 | |||
| US20090078956A1 | 2009-03-26 |
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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