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Patent Searching and Data


Title:
LIGHT-EMITTING DEVICE PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND DISPLAY PANEL
Document Type and Number:
WIPO Patent Application WO/2019/205611
Kind Code:
A1
Abstract:
Disclosed are a light-emitting device packaging structure and a manufacturing method therefor, and a display panel. The light-emitting device packaging structure comprises: a first substrate; a second substrate provided opposite to the first substrate; a light-emitting device, the light-emitting device being located on one side of the second substrate facing the first substrate; a packaging layer, the material of the packaging layer comprising a water absorbing material, the packaging layer being filled in edge regions of the first substrate and the second substrate, the packaging layer, the first substrate, and the second substrate forming a closed space, and the light-emitting device being located in the closed space; and a transparent filler, the closed space being filled with the transparent filler. The problems of the poor packaging effect and short service life of the light-emitting device are solved.

Inventors:
CHEN SHIHLUN (CN)
QU LITAO (CN)
Application Number:
PCT/CN2018/117031
Publication Date:
October 31, 2019
Filing Date:
November 22, 2018
Export Citation:
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Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO LTD (CN)
International Classes:
H01L51/56; H01L51/52
Foreign References:
CN108598280A2018-09-28
CN107799664A2018-03-13
Attorney, Agent or Firm:
TDIP & PARTNERS (CN)
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