LIGHT EMITTING DEVICE

Title:

LIGHT EMITTING DEVICE

Document Type and Number:

WIPO Patent Application WO/2011/040372

Kind Code:

A1

Abstract:

Disclosed is a light emitting device that enables a small and lightweight semiconductor package to be precisely mounted on a packaging substrate. The light emitting device is provided with a semiconductor package (10), which is provided with a first and second conductive member (11, 12), connected to a packaging substrate (20), which is provided with a first and second wiring section (21, 22) with wiring being separately connected to the first and second conductive member. The semiconductor package (10) is equipped with a light emitting element (13), the first conductive member (11) on which the light emitting element (13) is mounted, and the second conductive member (12) which has a smaller area than the first conductive member (11). The reverse of the first and second conductive members (11, 12) form the underside of the semiconductor package (10), and the first and second wiring sections (12, 22) are provided with narrow sections (21b, 22b) and wide sections (21a, 22a) which are wider than the narrow sections and extend in a direction away from the first and second conductive members (11, 12). At least the narrow sections (21b, 22b) are connected in some way to the first and second conductive members (11, 12) and the first wiring section (21) has a recess (21c) inside.

Inventors:

NAKABAYASHI TAKUYA (JP)

Application Number:

PCT/JP2010/066701

Publication Date:

April 07, 2011

Filing Date:

September 27, 2010

Export Citation:

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Assignee:

NICHIA CORP (JP)
NAKABAYASHI TAKUYA (JP)

International Classes:

H01L33/48

Domestic Patent References:

WO2007015426A1

2007-02-08

Foreign References:

JP2003324214A	2003-11-14
JPH0236073U	1990-03-08
JP2000012728A	2000-01-14
JP2008053423A	2008-03-06
JP2006303388A	2006-11-02
JP2006156704A	2006-06-15

Other References: