Title:
LIGHT EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/105448
Kind Code:
A1
Abstract:
Provided is a light emitting device wherein efficiency of light extraction from an LED package is improved, while ensuring mechanical strength and electrical insulation of a circuit board, in which the LED package is mounted in the opening from the rear surface side. This light emitting device has: a circuit board, in which an opening is formed; at least one LED package, which has a package substrate, an LED element mounted on the package substrate, and a sealing resin sealing the LED element, and which is inserted into the opening from the rear surface side of the circuit board, and in which an end portion of the upper surface of the package substrate is solder-bonded to the rear surface of the circuit board; and an insulating spacer, which is fixed to the rear surface of the circuit board, and which surrounds the sides of the package substrate. When the rear surface of the circuit board is set as height reference, the height of the upper surface of the sealing resin, said upper surface being the light emitting surface of the LED package, is set equal to or more than the height of the upper surface of the circuit board.
Inventors:
TAMURA RYO (JP)
Application Number:
PCT/JP2017/042644
Publication Date:
June 14, 2018
Filing Date:
November 28, 2017
Export Citation:
Assignee:
CITIZEN ELECTRONICS (JP)
CITIZEN WATCH CO LTD (JP)
CITIZEN WATCH CO LTD (JP)
International Classes:
H01L33/54; F21V19/00; F21V29/503; F21V29/70; H01L23/40; H01L33/00; F21Y115/10
Foreign References:
| JP2008034488A | 2008-02-14 | |||
| CN102185090A | 2011-09-14 | |||
| US20120110842A1 | 2012-05-10 | |||
| JP2005136224A | 2005-05-26 |
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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