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Title:
LIGHT-EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/116350
Kind Code:
A1
Abstract:
Provided is a light-emitting device having a CSP structure, the light-emitting device being provided with: a support substrate 10; a first metallic film 40 disposed over the support substrate 10; a second metallic film 30 embedded in an upper portion of the first metallic film 40 and having side surfaces and a bottom surface covered by the first metallic film 40; and a light-emitting element 20 that covers the upper surface of the second metallic film 30 and is disposed over the first metallic film 40. The second metallic film 30 has a higher reflectivity for light exiting the light-emitting element 20 than the first metallic film 40, and migration is less likely to occur in the first metallic film 40 than in the second metallic film 30.

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Inventors:
MATSUO TETSUJI (JP)
Application Number:
PCT/JP2016/087787
Publication Date:
June 28, 2018
Filing Date:
December 19, 2016
Export Citation:
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Assignee:
SANKEN ELECTRIC CO LTD (JP)
International Classes:
H01L33/10; H01L33/36
Foreign References:
JP2011166150A2011-08-25
JP2016207924A2016-12-08
JP2007042952A2007-02-15
JP2015159203A2015-09-03
JP2014158001A2014-08-28
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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