Title:
LIGHT-EMITTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/157431
Kind Code:
A1
Abstract:
A light-emitting device according to an embodiment of the present disclosure comprises: a substrate having a first surface and a second surface opposite one another; a first contact layer layered on the first surface of the substrate; a buffer layer layered on the first contact layer and in which at least one of carrier concentration, material composition and compositional ratio is different from that of the first contact layer; and a semiconductor laminate layered on the first surface of the substrate with the first contact layer and the buffer layer therebetween, the semiconductor laminate having a light-emitting region capable of emitting a laser beam.
Inventors:
ARAKIDA TAKAHIRO (JP)
Application Number:
PCT/JP2021/002636
Publication Date:
August 12, 2021
Filing Date:
January 26, 2021
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01S5/042; H01S5/183; H01S5/42
Foreign References:
| JPH11330554A | 1999-11-30 | |||
| JPH11214750A | 1999-08-06 | |||
| JP2005243900A | 2005-09-08 | |||
| JP2004095838A | 2004-03-25 | |||
| JP2010016172A | 2010-01-21 | |||
| JP2000151025A | 2000-05-30 | |||
| JP2015041627A | 2015-03-02 | |||
| JP2019033210A | 2019-02-28 | |||
| JP2013527484A | 2013-06-27 | |||
| US5625202A | 1997-04-29 | |||
| JPH05211346A | 1993-08-20 | |||
| JP2020019567A | 2020-02-06 |
Other References:
See also references of EP 4084242A4
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
Download PDF: