LIGHT-EMITTING DIODE, LIGHT-EMITTING DIODE LAMP, AND METHOD FOR PRODUCING LIGHT-EMITTING DIODE

WIPO Patent Application WO/2010/095361

A1

Disclosed is a light-emitting diode having excellent heat dissipation properties, wherein cracks in a substrate during the joining are suppressed.  The light-emitting diode is capable of emitting light with high luminance when a high voltage is applied thereto.  Also disclosed are a light-emitting diode lamp and a method for producing a light-emitting diode.  Specifically disclosed is a light-emitting diode (1) wherein a heatsink substrate (5) is joined to a light-emitting part (3) containing a light-emitting layer (2).  The heatsink substrate (5) is obtained by alternately laminating first metal layers (21) and second metal layers (22).  The first metal layers (21) are formed from a material that has a heat conductivity of not less than 130 W/m·K and a thermal expansion coefficient generally equal to that of the material for the light-emitting part (3).  The second metal layers (22) are formed from a material that has a heat conductivity of not less than 230 W/m·K.

TAKEUCHI RYOUICHI (JP)
MATSUMURA ATSUSHI (JP)
MASUYA KYOUSUKE (JP)

PCT/JP2010/000399

August 26, 2010

January 25, 2010

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SHOWA DENKO KK (JP)
TAKEUCHI RYOUICHI (JP)
MATSUMURA ATSUSHI (JP)
MASUYA KYOUSUKE (JP)

H01L33/64; F21S2/00; F21Y101/02

JP2005044887A	2005-02-17
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JPH06302857A	1994-10-28
JP2002246640A	2002-08-30
JP2588849B2	1997-03-12
JP2001057441A	2001-02-27
JP2007081010A	2007-03-29
JP2006032952A	2006-02-02
JP2005236303A	2005-09-02

SHIGA, Masatake et al. (JP)
Masatake Shiga (JP)

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