Title:
LIGHT-EMITTING DIODE PACKAGE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/016842
Kind Code:
A1
Abstract:
A light-emitting diode package according to an embodiment comprises: a base substrate having a first electrode and a second electrode; a housing disposed on the base substrate and having a partition defining a first cavity for mounting a light-emitting diode; the light-emitting diode mounted in the first cavity and electrically connected to the first and second electrodes; and a wavelength conversion plate disposed away from the light-emitting diode and over the partition.
Inventors:
PARK BYOUNG KYU (KR)
NEI MASAMI (KR)
YOU JONG KYUN (KR)
NEI MASAMI (KR)
YOU JONG KYUN (KR)
Application Number:
PCT/KR2017/007706
Publication Date:
January 25, 2018
Filing Date:
July 18, 2017
Export Citation:
Assignee:
SEOUL SEMICONDUCTOR CO LTD (KR)
International Classes:
H01L33/48; H01L33/50; H01L33/52; H01L33/62; F21Y101/00
Foreign References:
| KR20140132516A | 2014-11-18 | |||
| KR20150077208A | 2015-07-07 | |||
| KR20110094690A | 2011-08-24 | |||
| KR20150001101U | 2015-03-12 | |||
| JP2009295909A | 2009-12-17 |
Attorney, Agent or Firm:
AIP PATENT & LAW FIRM (KR)
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