LIGHT-EMITTING DIODE, PACKAGE SUBSTRATE STRUCTURE AND PACKAGING METHOD

Title:

LIGHT-EMITTING DIODE, PACKAGE SUBSTRATE STRUCTURE AND PACKAGING METHOD

Document Type and Number:

WIPO Patent Application WO/2016/000584

Kind Code:

A1

Abstract:

The invention provides a light-emitting diode, a package substrate structure and a packaging method. The connection end of a P-type electrode of the light-emitting diode and the connection end of an N-type electrode of the light-emitting diode are installed at the same end. Meanwhile, a slot is formed in the package substrate structure, and connection metal is installed in the slot. When packaging is carried out, the end, provided with the connection ends, of the light-emitting diode is inserted in the slot in the package substrate structure, a routing process is omitted, and meanwhile 360-degree light emitting of the light-emitting diode can be achieved. No DBR structure is needed, and the process complexity is reduced.

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Inventors:

ZHANG YU (CN)

Application Number:

PCT/CN2015/082624

Publication Date:

January 07, 2016

Filing Date:

June 29, 2015

Export Citation:

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Assignee:

ENRAYTEK OPTOELECTRONICS CO (CN)

International Classes:

H01L33/00; H01L33/38; H01L33/48; H01L33/62

Foreign References:

CN102244169A	2011-11-16
JP2014022380A	2014-02-03
TW200305280A	2003-10-16

Attorney, Agent or Firm:

SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY (CN)
上海思微知识产权代理事务所（普通合伙） (CN)

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