Title:
LIGHT EMITTING DIODE PACKAGING STRUCTURE AND PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/184082
Kind Code:
A1
Abstract:
A light emitting diode packaging structure comprises a base substrate (1); a metal lead (3) on the base substrate (1); a cover plate (2); and a seal frame (4) sealing the cover plate (2) and the base substrate (1) together and forming an enclosure surrounding a display area (111) of the base substrate (1). The metal lead (3) extends from the display area (111) outwardly and passes through below the seal frame (4) to outside of the enclosure. The metal lead (3) has a curved configuration in plan view of the base substrate (1) within a region where the metal lead (3) overlaps with the seal frame (4).
Inventors:
LI YI (CN)
Application Number:
PCT/CN2015/096938
Publication Date:
November 24, 2016
Filing Date:
December 10, 2015
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L51/56; H01L51/52
Foreign References:
| CN104882566A | 2015-09-02 | |||
| CN104157792A | 2014-11-19 | |||
| US20120293064A1 | 2012-11-22 | |||
| US20150102293A1 | 2015-04-16 |
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (10th Floor Tower D, Minsheng Financial Center,28 Jianguomennei Avenue, Dongcheng District, Beijing 5, CN)
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