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Patent Searching and Data


Title:
LIGHT-EMITTING ELEMENT MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/102738
Kind Code:
A1
Abstract:
The present invention provides a light-emitting element manufacturing method comprising: (1) a step of fabricating a light-emitting element wafer by forming on a starting substrate a layered structure including a light-emitting layer portion; (2) a step of preparing a support substrate; (3) a step of causing the support substrate to adhere to the light-emitting element wafer with an adhesive layer therebetween; (4) a step of removing the starting substrate and exposing the first semiconductor layer; (5) a step of forming a removed portion; (6) a step of forming a first ohmic electrode and a second ohmic electrode; and (7) a step of, by a scribe/breaking method using laser light, separating a light-emitting element from the bonded substrate in a dice shape, characterized in that, before scribing, the adhesive layer in a scribe region is removed in advance. Thus, provided is a light-emitting element manufacturing method by which, in the scribe/breaking step, destruction and peeling of a visible transparent adhesive agent from a bonded portion due to absorption of laser energy is suppressed.

Inventors:
ISHIZAKI Junya (Shin-Etsu Handotai Co. Ltd., 13-1, Isobe 2-chome, Annaka-sh, Gunma 96, 〒3790196, JP)
FURUYA Shogo (Shin-Etsu Handotai Co. Ltd., 13-1, Isobe 2-chome, Annaka-sh, Gunma 96, 〒3790196, JP)
AKIYAMA Tomohiro (Shin-Etsu Handotai Co. Ltd., 13-1, Isobe 2-chome, Annaka-sh, Gunma 96, 〒3790196, JP)
Application Number:
JP2018/038071
Publication Date:
May 31, 2019
Filing Date:
October 12, 2018
Export Citation:
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Assignee:
SHIN-ETSU HANDOTAI CO., LTD. (2-1 Ohtemachi 2-chome, Chiyoda-ku Tokyo, 04, 〒1000004, JP)
International Classes:
H01L33/02; B23K26/00; B23K26/364; H01L21/301
Foreign References:
JP2010123742A2010-06-03
JP2016225586A2016-12-28
JP2009277884A2009-11-26
JP2007234902A2007-09-13
US6071795A2000-06-06
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (1st Shitaya Bldg. 8F, 6-11 Ueno 7-chome, Taito-k, Tokyo 05, 〒1100005, JP)
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