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Title:
LIGHT EMITTING ELEMENT PACKAGE
Document Type and Number:
WIPO Patent Application WO/2019/212254
Kind Code:
A1
Abstract:
A light emitting element package comprises: a substrate having a wire unit provided therein; a reflecting film provided on the substrate; a light emitting element installed on the substrate and connected to the wire unit; and a cover unit for covering the light emitting element while being in contact with the upper surface of the light emitting element. The cover unit and the reflecting film contain Teflon-based organic polymers, and the organic polymers of the reflecting film are stretched and expanded.

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Inventors:
BILENKO YURIY (KR)
PARK KI YON (KR)
Application Number:
PCT/KR2019/005259
Publication Date:
November 07, 2019
Filing Date:
May 02, 2019
Export Citation:
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Assignee:
SEOUL VIOSYS CO LTD (KR)
International Classes:
H01L33/48; H01L33/10; H01L33/20; H01L33/38; H01L33/62
Foreign References:
KR101197046B12012-11-06
KR101188566B12012-10-05
KR101307131B12013-09-23
KR100616680B12006-08-28
KR100623024B12006-09-19
Other References:
See also references of EP 3790061A4
Attorney, Agent or Firm:
LEE, Ki Sung (KR)
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