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Title:
LIGHT-EMITTING MODULE SUBSTRATE, LIGHT-EMITTING MODULE, SUBSTRATE FOR LIGHT-EMITTING MODULE HAVING COOLER, AND PRODUCTION METHOD FOR LIGHT-EMITTING MODULE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/051798
Kind Code:
A1
Abstract:
This light-emitting module substrate has a circuit layer to which a light-emitting element is mounted, formed on one surface of an insulation layer. A metal layer comprising Al or an Al alloy and a heat sink are laminated, in order, on the other surface side of the insulation layer, said heat sink having Cu present in at least the surface bonded to the metal layer. The metal layer and the heat sink are bonded by solid-phase diffusion, in the bonded surface, and the thickness of the circuit layer is no more than 0.1 mm.

Inventors:
NAGASE TOSHIYUKI (JP)
KOMASAKI MASAHITO (JP)
IWAZAKI WATARU (JP)
Application Number:
PCT/JP2016/077686
Publication Date:
March 30, 2017
Filing Date:
September 20, 2016
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L33/62; B23K1/00; B23K20/00; B23K35/30; C22C5/02; H01L23/12; H01L23/13; H01L23/36; H01L23/40; H01L33/64; B23K101/42; B23K103/10; B23K103/12; B23K103/18
Domestic Patent References:
WO2013147144A12013-10-03
WO2008126564A12008-10-23
Foreign References:
JP2015149349A2015-08-20
JP2007087983A2007-04-05
JP2013229561A2013-11-07
JP2014054653A2014-03-27
JP2014112696A2014-06-19
JP2014026769A2014-02-06
JP2008277654A2008-11-13
Other References:
See also references of EP 3355370A4
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
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