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Title:
LIGHT-EMITTING MODULE
Document Type and Number:
WIPO Patent Application WO/2016/194370
Kind Code:
A1
Abstract:
A light-emitting module is provided with a light-emitting element having: a flexible first insulation substrate having a plurality of conductive patterns formed in the surface thereof; a first electrode disposed in a first region of a surface facing the first insulation substrate, the first electrode being connected to a first conductive pattern from among the plurality of conductive patterns with a first bump interposed therebetween; and a second electrode disposed in a second region of the surface facing the first insulation substrate, the second region being different from the first region, and the second electrode being connected to a second conductive patter different from the first conductive pattern with a second bump interposed therebetween. The ratio of the distance from the first region to the point of contact between the first bump and the first conductive pattern with respect to the distance from the first electrode to a position at which the outer edge of the first conductive pattern and the outer edge of the second region intersect is 0.1 or greater.

Inventors:
MAKI KEIICHI (JP)
Application Number:
PCT/JP2016/002650
Publication Date:
December 08, 2016
Filing Date:
June 01, 2016
Export Citation:
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Assignee:
TOSHIBA HOKUTO ELECTRONICS CORP (JP)
International Classes:
H01L33/62; F21S2/00; F21V19/00; F21V23/00; F21Y101/00
Domestic Patent References:
WO2014156159A12014-10-02
WO2009034793A12009-03-19
WO2015083365A12015-06-11
Foreign References:
JP2008034505A2008-02-14
JP2011228463A2011-11-10
JPH10163258A1998-06-19
JP2001176908A2001-06-29
JP2014160880A2014-09-04
JP2015035438A2015-02-19
JP2010226086A2010-10-07
Other References:
See also references of EP 3306684A4
Attorney, Agent or Firm:
AMAGI INTERNATIONAL PATENT LAW OFFICE (JP)
Patent business corporation Amagi international patent firm (JP)
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