Title:
LIGHT-EMITTING SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/097445
Kind Code:
A1
Abstract:
A light-emitting substrate and a preparation method therefor, and a display device. The light-emitting substrate comprises a substrate, and a die-bonding structure, a light-shading structure and a light-emitting chip, which are arranged on the substrate. The light-emitting chip is arranged on the side of the die-bonding structure that is away from the substrate, and the light-shading structure is located on the peripheral side of the light-emitting chip. The light-emitting substrate further comprises a welding-assisting functional layer covering the side of the die-bonding structure that is away from the substrate; the light-shading structure comprises a light-shading material layer and a partition structure; and the welding-assisting functional layer is blocked at the partition structure.
Inventors:
NIU YANAN (CN)
QU YAN (CN)
YANG MING (CN)
PENG JINTAO (CN)
QIN BIN (CN)
CHEN WANZHI (CN)
QU YAN (CN)
YANG MING (CN)
PENG JINTAO (CN)
QIN BIN (CN)
CHEN WANZHI (CN)
Application Number:
PCT/CN2021/134395
Publication Date:
June 08, 2023
Filing Date:
November 30, 2021
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
International Classes:
H01L29/786; H01L27/12; H01L33/48
Foreign References:
| CN112687748A | 2021-04-20 | |||
| CN110176463A | 2019-08-27 | |||
| CN209896060U | 2020-01-03 | |||
| CN112599552A | 2021-04-02 |
Attorney, Agent or Firm:
AFD CHINA INTELLECTUAL PROPERTY LAW OFFICE (CN)
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