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Title:
LIGHT-PERMEABLE CONDUCTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2017/002609
Kind Code:
A1
Abstract:
A light-permeable conductive material characterized by having, on a light-permeable support, at least a sensor part electrically connected to a terminal part via a peripheral wiring part, and a dummy part not electrically connected to the terminal part, the sensor part and the dummy part having a meshed metal thin-wire pattern in which a plurality of polygons are aggregated, the metal thin-wire pattern in the dummy part having a broken-wire part and the metal thin-wire pattern in the dummy part having a region satisfying the requirement in 1) and/or a region satisfying the requirement in 2). 1) All of the polygons sharing vertexes with polygons not having a broken-wire part have at least one broken-wire part. 2) All of the polygons sharing vertexes with two polygons sharing a side or vertex and not having a broken-wire part have at least one broken-wire part.

Inventors:
YOSHIKI TAKENOBU (JP)
Application Number:
PCT/JP2016/067701
Publication Date:
January 05, 2017
Filing Date:
June 14, 2016
Export Citation:
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Assignee:
MITSUBISHI PAPER MILLS LTD (JP)
International Classes:
G06F3/044; G06F3/041; H01B5/14
Foreign References:
JP2013143045A2013-07-22
JP2010262529A2010-11-18
JP2012146277A2012-08-02
Attorney, Agent or Firm:
YASUTOMI & ASSOCIATES (JP)
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