Title:
LIGHT-SENSITIVE RESIN COMPOSITION, ETCHING METHOD, AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/164217
Kind Code:
A1
Abstract:
A light-sensitive resin composition containing (A) an alkali-soluble resin, (B) a photopolymerization initiator, and (C) an acrylate monomer, and which may further contain (D) a methacrylate monomer. The (C) acrylate monomer contains (C1) a double bond equivalent amount of 250 or more of the acrylate monomer and (C2) a double bond equivalent amount of 150 or less of the acrylate monomer. The content of the (D) methacrylate monomer is 0-5 mass% of the (C) acrylate monomer, the content of the (C1) double bond equivalent of 250 or more of the acrylate monomer being 40-60 mass%, the content of the (C2) double bond equivalent amount of 150 or less of the acrylate monomer is 40-60 mass%, and the content of the (B) photopolymerization initiator is 0.5-1.5 mass% of the light-sensitive resin composition. The present invention further provides an etching method and a plating method using the light-sensitive resin composition.
Inventors:
IRISAWA MUNETOSHI (JP)
KAJIYA KUNIHITO (JP)
TOYODA YUJI (JP)
KAJIYA KUNIHITO (JP)
TOYODA YUJI (JP)
Application Number:
PCT/JP2018/008940
Publication Date:
September 13, 2018
Filing Date:
March 08, 2018
Export Citation:
Assignee:
MITSUBISHI PAPER MILLS LTD (JP)
International Classes:
G03F7/027; C08F2/48; C08F2/50; C08F290/06; C08J7/043; G03F7/031; H05K3/06; H05K3/18
Foreign References:
| JPS5749105A | 1982-03-20 | |||
| JP2014235391A | 2014-12-15 | |||
| JP2009020191A | 2009-01-29 | |||
| JP2004341059A | 2004-12-02 | |||
| JP2013037272A | 2013-02-21 |
Attorney, Agent or Firm:
OHSHIMA Masataka (JP)
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