LIGHT-SHIELDING COMPOSITION, CURED FILM, LIGHT-SHIELDING FILM, AND SOLID-STATE IMAGING ELEMENT

Title:

LIGHT-SHIELDING COMPOSITION, CURED FILM, LIGHT-SHIELDING FILM, AND SOLID-STATE IMAGING ELEMENT

Document Type and Number:

WIPO Patent Application WO/2020/066420

Kind Code:

A1

Abstract:

Provided is a light-shielding composition which enables the formation of a cured film having excellent light-shielding properties, low reflectance, and light resistance. Also provided are a cured film, a light-shielding film, and a solid-state imaging element. This light-shielding composition contains a blacking material, a polymerizable compound, a photopolymerization initiator, and a resin. The resin contains a polymerizable group and a group represented by general formula (1). The number average molecular weight of the resin is 100 to 15000. The resin content is 2.0 to 15.0% by mass of the total solids content by mass of the light-shielding composition. (1): *-(SiR1R2-O)na-*

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Inventors:

HAMADA DAISUKE (JP)
OYA TAKAHIRO (JP)
KATO RYOSUKE (JP)

Application Number:

PCT/JP2019/033357

Publication Date:

April 02, 2020

Filing Date:

August 26, 2019

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

G02B5/00; G02B5/20; G02B5/22; G03F7/004; G03F7/075; H01L27/146; H01L31/0232

Domestic Patent References:

WO2007061115A1	2007-05-31
WO2010001976A1	2010-01-07

Foreign References:

JP2011001538A	2011-01-06
JP2009244736A	2009-10-22
JP2016035564A	2016-03-17
JP2005134439A	2005-05-26
JP2015109384A	2015-06-11
JP2010018653A	2010-01-28
JP2012083571A	2012-04-26