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Patent Searching and Data


Title:
LIGHTING APPARATUS HAVING MOUNTING SUBSTRATE FOR LED LIGHTING
Document Type and Number:
WIPO Patent Application WO/2019/093339
Kind Code:
A1
Abstract:
The purpose of the present invention is to reduce or prevent glare and multiple shadows in surface mounted device (SMD) type lighting equipment in which a high-output chip scale package (CSP) device is used. Provided is a lighting apparatus which comprises: a substrate having a plurality of electrically conductive portions; and a plurality of individually sealed surface-mounted LED elements which are mounted so as to be respectively connected to the plurality of electrically conductive portions of the substrate. The substrate includes a phosphor layer which includes a first phosphor and covers at least a part of a surface on the side on which the plurality of surface-mounted LED elements are mounted. The first phosphor is excited by means of a light emission wavelength of at least one of the plurality of surface-mounted LED elements. The plurality of surface-mounted LED elements are not integrally sealed.

Inventors:
KONISHI,Masahiro (Omuta Plant1,Shinkai-machi,Omuta-cit, Fukuoka 10, 〒8368510, JP)
Application Number:
JP2018/041225
Publication Date:
May 16, 2019
Filing Date:
November 06, 2018
Export Citation:
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Assignee:
DENKA COMPANY LIMITED (1-1Nihonbashi-Muromachi 2-chome, Chuo-ku Tokyo, 38, 〒1038338, JP)
International Classes:
F21V19/00; H01L33/50; F21Y115/10
Foreign References:
JP2015511775A2015-04-20
JP2011090972A2011-05-06
JP2017139309A2017-08-10
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (Shimbashi i-mark Bldg, 6-2 Shimbashi 2-Chome Minato-k, Tokyo 04, 〒1050004, JP)
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