received by the International Bureau on 07 January 2016 (07.01.2016)

1. A lighting device, comprising:

a base;

at least one light emitting chip;

at least one optical member covering the light emitting chip; and

a thermally conductive adhesive layer having opposite sides directly contacting the light emitting chip and the base, respectively

wherein the base is electrically insulated and the thermally conductive adhesive layer is electrically coupled to the light emitting chip.

2. The lighting device according to claim 1 , wherein the optical member is configured to change the light spectrum of light emitted by the light emitting chip.

3. The lighting device according to claim 2, wherein the optical member comprises a phosphor.

4. The lighting device according to claim 1 , wherein the optical member comprises an optical lens.

5. The lighting device according to claim 1, wherein the optical member comprises a packaging adhesive.

6. The lighting device according to claim 1, wherein the base comprises a ceramic material.

7. The lighting device according to claim 1, wherein the thermally conductive adhesive layer comprises a circuit layer.

8. The lighting device according to claim 7, wherein the circuit layer comprises conductive silver paste.

9. The lighting device according to claim 7, wherein the circuit layer comprises a metal selected from the group consisting of molybdenum, manganese, wolframium, argentum, aurum, platinum, silver palladium alloy, cuprum, aluminum and stannum.

10. The lighting device according to claim 1, wherein the thermally conductive adhesive layer comprises an electrically insulated coating on the base.

11. The lighting device according to claim 10, wherein the insulated thermally conductive adhesive layer comprises a diamond film, an insulating varnish or a ceramic layer.

12. The lighting device according to claim 1, wherein the base includes an auxiliary heat dissipation structure comprising:

a plurality of heat dissipation ribs radially extending outwardly from the base, and a ring structure with heat dissipation grooves surrounding the heat dissipation ribs.

13. The lighting device according to claim 1, wherein the light emitting chip comprises an LED chip.

14. The lighting device according to claim 1, wherein

the at least one light emitting chip comprises a plurality of light emitting chips disposed on the thermally conductive adhesive layer;

the at least one optical member comprises a plurality of optical members each respectively covering at least one of the light emitting chips; and

the lighting device further comprises a common optical shield enclosing the light emitting chips and the optical members on the upper surface of the base.

15. The lighting device according to claim 14, wherein each the optical members respectively covers at least two of the light emitting chips.

16. The lighting device according to claim 15, wherein the base has a shape that is flared upwardly from a lower portion of the base toward the upper surface of the base, at least two through-holes are disposed in the base, and at least two pins extend through the at least two through-holes to be connected to a power source.

A LED luminaire, comprising:

a plurality of LED components, each LED component including:

a base;

a thermally conductive adhesive layer coated on the top surface of the base; an LED chip disposed on the thermally conductive adhesive layer; and an optical member covering the LED chip; and

a frame defining a plurality of cavities for accommodating the corresponding LED components;

wherein the base is electrically insulated and the thermally conductive adhesive layer is electrically coupled to the light emitting chip.

18. A lighting device, comprising:

a base;

a thermally conductive adhesive layer coated on the top surface of the base; and a light emitting chip disposed on the thermally conductive adhesive layer;

an optical member covering the light emitting chip;

wherein the base is electrically insulated and the thermally conductive adhesive layer is electrically coupled to the light emitting chip, and

wherein the lighting device is free of a circuit board between the base and the light emitting chip.

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