Title:
LIGHTING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/077998
Kind Code:
A1
Abstract:
Disclosed is a lighting device that prevents deformations in the casing, etc., thereof caused by heat being emitted when the light source is lit, thereby avoiding risk that the quality of illumination of a member being illuminated will deteriorate. The lighting device comprises a light source unit (23), whereupon light sources (22) are positioned upon a circuit substrate (21); an LCD panel (24) which is the member being illuminated by the light that is emitted from the light sources (22); a casing (27), further comprising a hollow portion (50) that is disposed so as to accommodate the light sources (22); and a diffusion member (25) that is installed upon the casing (27). The circuit substrate (21) is mounted so as to block the lower end aperture (51) of the hollow portion (50), and the diffusion member (25) is mounted so as to block the upper end aperture (52) of the hollow portion (50), which constitutes the opposite end of the hollow portion (50) from the lower end aperture (51) thereof. Radiation units (61d, 61f, 62d, 62f) are formed upon the casing (27) in order to radiate heat caused by the light sources (22) outside the casing (27).
Inventors:
MIYAMOTO,Itsuhiro (())
Application Number:
JP2010/072428
Publication Date:
June 30, 2011
Filing Date:
December 14, 2010
Export Citation:
Assignee:
NIPPON SEIKI CO.,LTD. (2-34, Higashi-zaoh 2-chomeNagaoka-sh, Niigata 80, 〒9408580, JP)
日本精機株式会社 (〒80 新潟県長岡市東蔵王２丁目２番３４号 Niigata, 〒9408580, JP)
日本精機株式会社 (〒80 新潟県長岡市東蔵王２丁目２番３４号 Niigata, 〒9408580, JP)
International Classes:
F21S2/00; F21V29/00; G09F9/00; F21Y101/02
Download PDF:
Previous Patent: DISPLAY DEVICE
Next Patent: PAD FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF CHEMICAL MECHANICAL POLISHING USING SAME
Next Patent: PAD FOR CHEMICAL MECHANICAL POLISHING AND METHOD OF CHEMICAL MECHANICAL POLISHING USING SAME