LIGHTWEIGHT MEDIUM-ENTROPY ALLOYS USING SPINODAL DECOMPOSITION

WIPO Patent Application WO/2020/013524

A1

The present disclosure provides a medium-entropy alloy with 25 to 35 at% of Cu, 25 to 35 at% of Fe, 25 to 35 at% of Mn, and up to 15 at% of Al. The medium-entropy alloy according to the present disclosure may secure price competitiveness by reducing the amount of Co, Cr, Ni, and the like which are expensive elements frequently used in a high-entropy alloy system added and combining Al, Cu, Fe, and Mn which are inexpensive alloy elements, and may also achieve lightweight by adjusting the content of Al of the alloy. Simultaneously, the medium-entropy alloy has excellent characteristics of a yield strength of 470 MPa or more, a tensile strength of 626 MPa or more, and an elongation of 36% or more at room temperature (298 K).

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SHIN HYUNKWON (KR)
KANG NAMSEOK (KR)
OH JINMOK (KR)
KIM HYOUNGSEOP (KR)
DO HYEONSEOK (KR)
MOON JONGUN (KR)
PARK JEONGMIN (KR)
LEE BYEONGJOO (KR)

PCT/KR2019/008210

January 16, 2020

July 04, 2019

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LG ELECTRONICS INC (KR)
POSTECH ACAD IND FOUND (KR)

C22C30/02; C22C1/02

US20170369970A1	2017-12-28
KR20090030198A	2009-03-24
US20020159914A1	2002-10-31
KR20170124441A	2017-11-10
JP2016023352A	2016-02-08

PARK, Jang-Won (KR)

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