LINEAR FRICTION BONDING DEVICE AND JIG POSITION-ADJUSTING DEVICE AND POSITION-ADJUSTING METHOD

WIPO Patent Application WO/2017/135187

A1

This linear friction bonding device is for bonding, by frictional heat, a blade-side bonding surface of a blade and a disc-side bonding surface of a disc protrusion provided on the outer circumferential surface of a disc. The linear friction bonding device is equipped with a disc holder unit provided to a pressing table, the disc holder unit holding the disc. The disc holder unit has: a unit base supported by the pressing table; a rotating table provided on one side of the unit base in the thickness direction so as to be rotatable about an axial core, the rotating table being such that a disc can be mounted on the rotating table in a concentric manner, the rotating table rotating about the axial core and thereby making it possible to index a disc protrusion at the bonding position at which bonding is to be performed; a rotation actuator for causing the rotating table to rotate about the axial core; and a fixing part for fixing the rotating table to the unit base.

TANIDA MASAHIRO (JP)
AKIYAMA KEN (JP)
FUJITA TAKAFUMI (JP)
ASANO NOZOMU (JP)
DODO YASUSHI (JP)
KAWASHIMA HIROAKI (JP)
MORITA ICHIROU (JP)
WAKABAYASHI TSUKASA (JP)
NAKAMURA KENJI (JP)

PCT/JP2017/003146

August 10, 2017

January 30, 2017

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IHI CORP (JP)

B23K20/12; F01D5/30; F01D5/34; F01D25/00; F02C7/00; B23P15/04; B23Q3/02

JP2015108338A	2015-06-11
JP2012017720A	2012-01-26
US20110002789A1	2011-01-06
US20120318774A1	2012-12-20

MIYOSHI Hidekazu et al. (JP)

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