Title:
LINEAR IMAGE SENSOR AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2018/030147
Kind Code:
A1
Abstract:
This linear image sensor is provided with: first and second sensor chips 11A, 12A; first and second substrates 21, 22; a common supporting substrate 30; a supporting part 60; a dam part 70; and a sealing part 80. The first sensor chip 11A is mounted on one end portion of the first substrate 21 so as to partially protrude therefrom. The second sensor chip 12A is mounted on one end portion of the second substrate 22 so as to partially protrude therefrom. The first and second substrates 21, 22 are mounted on the common supporting substrate 30. The supporting part 60 is provided in the space between end faces of the first and second substrates 21, 22. The dam part 70 is in an annular shape and is arranged so as to surround the sensor chips 11A, 12A. The sealing part 80 seals the sensor chips 11A, 12A in the region surrounded by the dam part 70. Consequently, the present invention enables the achievement of a configuration wherein arrangement of sensor chips with high accuracy and planarity in the surface of the sealing part are easily ensured.
Inventors:
MURAMATSU NORIHIRO (JP)
NOZAWA KATSUNORI (JP)
NOZAWA KATSUNORI (JP)
Application Number:
PCT/JP2017/026892
Publication Date:
February 15, 2018
Filing Date:
July 25, 2017
Export Citation:
Assignee:
HAMAMATSU PHOTONICS KK (JP)
International Classes:
H01L27/146; H01L23/28; H04N1/028
Foreign References:
| JP2013150311A | 2013-08-01 | |||
| JPS6482851A | 1989-03-28 | |||
| JPH0548061A | 1993-02-26 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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