LINEAR OBJECT REMOVAL METHOD, LINEAR OBJECT REMOVAL DEVICE, AND ELECTRONIC/ELECTRIC APPARATUS COMPONENT SCRAP PROCESSING METHOD

WIPO Patent Application WO/2020/050274

A1

Provided are a linear object removal method, a linear object removal device, and an electronic/electric apparatus component scrap processing method that make it possible to efficiently sort out linear objects from objects to be sorted that include various shapes. The linear object removal method includes: disposing a plurality of filters 3 inside a vibrating sieve machine 1 by adjoining the filters so as to partially overlap each other along a raw material supply direction, the filters comprising a plurality of rods 2 which extend with intervals therebetween along the supply direction and beam parts 21 which support the plurality of rods 2 at one end 2a of each of the plurality of rods 2, with the other ends 2b of the plurality of rods 2 serving as free ends; and supplying the raw material, which includes at least linear objects and sheet-like objects, to the inside of the vibrating sieve machine 1, and imparting a vibration to the filters 3, thereby sifting the linear objects toward the sieve bottom of the vibrating sieve machine 1.

JPH0695917

[Title of Invention] Edamame Sorting Device

AOKI KATSUSHI (JP)
TAKEDA TSUBASA (JP)

PCT/JP2019/034638

March 12, 2020

September 03, 2019

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JX NIPPON MINING & METALS CORP (JP)

B07B13/04

WO2019151350A1

2019-08-08

JP2001205193A	2001-07-31
US5769240A	1998-06-23
JP2009142765A	2009-07-02
JPS5545032U	1980-03-24
CN2611055Y	2004-04-14
JP2017170388A	2017-09-28
JP2010051888A	2010-03-11
EP0492259A1	1992-07-01
JP2015150505A	2015-08-24
JP2015123418A	2015-07-06

See also references of EP 3862102A4

AXIS PATENT INTERNATIONAL (JP)

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